News

August 11, 2014

Rudolph Receives Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems

Large order for multiple NSX inspection tools includes Wafer Scanner system and Discover yield management software to provide a comprehensive 2D/3D solution for advanced packaging processes

August 4, 2014

Rudolph Technologies Reports 2014 Second Quarter Results

• Record High Software Revenue;
• Strong Gross Margins Drive Non GAAP Earnings to High End of Guidance

July 21, 2014

Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control

Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection down to 0.5μm