Yield Forum 2010

A Technology and Applications Forum presented by Rudolph Technologies

Register now:

November 11 -- Beijing

2010 Agenda Highlights

Wafer Fab (Front-end)

• Solutions/approaches to TSV inspection and metrology
• Benefits of immersion-related all-surface inspection
• Advanced macro CMP monitoring
• The COO Impact of Waferless Recipe creation
• Defect analysis/signature pattern characterization
• 3DIC bonded wafer program; bevel edge inspection
• Run to run control and fault detection
• Use of parametric applications in a foundry fab
• Young Modulus In-line characterization of low-k ILDs
• Advanced Metrology for 32nm process node and neyond
• Using ADC to lower cost of ownership

Registration opens at 8:30am; sessions close at 5:00pm

For more information or to register in person, contact:

Contact: Vanessa Song
Email: vanessa.song@rudolphtech.com
Tel: +(86) 21-60930600