Our yield forum will focus on key challenges and solutions for wafer processing and final manufacturing and test. Join industry experts and Rudolph technologists in Taiwan, as we share our expertise on new technologies, trends and solutions.
View our invitation in Chinese (225KB PDF)
Register today!
Taiwan
Tuesday, December 9
Ambassador Hotel
Hsinchu, Taiwan
Registration (8:30)
Session I Agenda
Wafer Processing
- Rudolph Technologies - Overview
- S3000A Field Performance: Transparent & Opaque Metrology Roadmap
- MetaPULSE for Cu Memory
- All-surface Inspection for the 45/32 nm Node
- Reducing the High Cost of Review
- Edge Inspection in FEOL
- Reduction of Systemic Yield Loss
- The Total Solution
Session II Agenda
Final Manfacturing
- Rudolph Technologies - Overview
- Trends in Inspection, Assembly & Test
- Improving Sort Yield Through Process Control
- Probe Card Manufacturing at FFI
- Bumping at Amkor
- 2D/3D Inspection
- Punch Through Detection
- Defect-based Automatic Die Classification to Facilitate Yield
All Attendees
Registration
Registration closes December 1. Registration is free of charge and admits attendees to presentations, coffee breaks and lunch. A copy of the forum proceedings is included.
To register
Contact
For more information contact:
Judy Hsu
judy.hsu@rudolphtech.com
(886) 3-516-9230 ext. 502