News

April 1, 2015

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

NSX Series was selected due to its specialized die boundary inspection and highly sensitive detection capabilities

March 10, 2015

Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications

Tool to be used for development of copper pillar bumping and TSV processes

February 9, 2015

Ruling Issued in Rudolph’s Patent Infringement Case Against Camtek

Damages and modified injunction reinstated against Camtek in US