Yield Forum Beijing
26 April 2012
presented by Rudolph Technologies

Location: Hotel Pullman Beijing South, 12 Ronghua South Road, Beijing Economic Technological Development Area, 100176 Beijing China

Time: Registration opens at 8:30am; sessions close at 5:00pm.

Returning to Beijing, the Yield Forum provides process engineers, fab managers and tool owners with new application data and process control techniques that address current process challenges.

2012 Agenda Highlights

• Metrology Techniques for Improved Pattern Recognition at Advanced Nodes
• Waferless Recipe Creation Challenges for 32nm and Beyond
• Uniformity Inspection Techniques for CMOS and CMP Inspection
• Edge and Backside Inspection
• Techniques for Yield Improvement
• Factory-wide Data Mining Techniques
• TSV Inspection and Metrology
• Advances in EP and Seed Cu Metrology

Register Now

Need more information?
Contact: Shelly Chen, Rudolph Technologies
Email: shelly.chen@rudolphtech.com
Tel: +(86) 21 60930660