Yield Forum Shanghai
24 April 2012
presented by Rudolph Technologies

Location: The Honta Hotel, 889 Dong Fang Road, Pudong District, Shanghai 200122

Time: Registration opens at 8:30am; sessions close at 5:00pm.

Returning to Shanghai, the Yield Forum provides process engineers, fab managers and tool owners with new application data and process control techniques that address current process challenges.

2012 Agenda Highlights

Wafer Processing Session (Front-end)

• Metrology Techniques for Improved Pattern Recognition at Advanced Nodes
• Waferless Recipe Creation Challenges for 32nm and Beyond
• Uniformity Inspection Techniques for CMOS and CMP Inspection
• Edge and Backside Inspection
• Techniques for Yield Improvement
• Factory-wide Data Mining Techniques
• TSV Inspection and Metrology
• Advances in EP and Seed Cu Metrology

Assembly and Test Session (Back-end)

• Trends in Back-end Inspection
• Inspection Solutions for Debonding Applications
• Pulse Metrology for Advanced Packaging
• Total Solution for Probe Process Monitoring
• TSV Inspection and Metrology
• Inspection Solutions Using Laser Triangulation in 3DICs
• Fault Detection and Classification
• Edge and Backside Inspection

Register Now

Need more information?
Contact: Shelly Chen, Rudolph Technologies
Email: shelly.chen@rudolphtech.com
Tel: +(86) 21 60930660