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Highlights
  • Receives Multiple System Orders from STATS ChipPAC for eWLB Inspection
  • Announces Multiple Orders for Explorer Inspection Cluster from Taiwan Foundry
  • Announces Automated Data Analysis Software Improves Yield in MEMS Inspection
  • Receives Multiple System Orders from ASE for its Complete Portfolio of Back-end Inspection Solutions
  • Offers Complete Solution for 200 and 300 mm Gold Bump Inspection
  • Releases Fast Review and Die Sort Classification Software for Back-end Manufacturing
  • Indicates Recovery Taking Hold, Back-end Semiconductor Manufacturing Heating Up
  • Announces Favorable Court Judgement in Patent Infringement Case
  • Acquires Adventa Control Technologies, Inc.
  • Receives Multiple Orders for Production Opaque Film Metrology
  • Multiple Orders for New Wafer Scanner 3840 Systems
  • Announces All Surface Front-end Inspection Sale to Memory Manufacturer