Home   |   Products   |   Inspection
Defect Inspection Systems to Improve Yield

Rudolph's macro defect inspection systems provide optimum resolution and throughput for maximum detectability and productivity for next-generation process requirements. A key contributor to our unique position as the macro inspection market leader in both front-end wafer processing and final manufacturing is our all-surface inspection systems for wafer frontside, edge and backside defects. And, Rudolph inspection solutions like the August NSX® Series continue to set the standard for outgoing quality control and post-fab applications including bump, saw and probe.

AXi 940 Module

Advanced Macro Defect Inspection

The synergy of resolution and throughput for today's advanced processes
Learn More
B30 Module

Wafer Backside Inspection

High-throughput full backside inspection of bare and product wafers with on-the-fly color image capture
Learn More
Discover Software

Lower the Cost of Macro Inspection and Review

In-line, all-surface defect analysis and data management
Learn More
E30 Module

Wafer Edge Inspection

High-throughput full edge inspection of bare and product wafers with on-the-fly color image capture
Learn More
E30+B30 Module

Wafer Edge and Backside Inspection

High-throughput full edge and backside inspection of bare and product wafers with on-the-fly color image capture
Learn More
Explorer Inspection Cluster

Advanced Macro Defect Inspection

Fast, accurate and reliable macro defect inspection - Click 'Learn More' for a 360 degree view of the Explorer Inspection Cluster
Learn More
F30 Module

Advanced Macro Defect Inspection

Designed to blur the lines between DF micro inspection and traditional macro inspection
Learn More
Harmony ASR Software

Quickly Review All-surface Defects

A fast, intuitive, off-line, all-surface review and classification solution
Learn More
NSX 320 System

Advanced Macro Defect Inspection

Designed specifically for advanced packaging processes that use TSV
Learn More
NSX Series

The Inspection Standard for Final Manufacturing

Probe mark inspection: quality assurance for Known Good Die and die products
Learn More
PrecisionWoRx VX4 System

Probe Card Test and Analysis

Efficient probe card test, analysis, and rework for fine pitch, small array probe cards
Learn More
Probe Card Interface

Custom Probe Card Interface

Customer and application-specific mechanical and electrical interfaces that are critical for the probe card test and analysis process
Learn More
ProbeWoRx 300 System

Probe Card Test and Analysis

High speed, high force, and high throughput for high pin-count, large array probe cards
Learn More
Refurbished Tool Program

Refurbished by Rudolph

Choose the quality of a Refurbished by Rudolph tool when considering a used tool
Learn More
TrueADC Enterprise Software

High Performance ADC for the Entire Fab

A single ADC system able to easily support multiple tool sets for the lowest cost of ownership model in the industry
Learn More
Wafer Scanner Series

3D/2D Wafer Inspection System

Superior defect detection for post-fab processes
Learn More
WaferWoRx 300 System

Wafer Probing Process Analysis

Scrub mark analysis for sort process control and yield improvement
Learn More