Rudolph's macro defect inspection systems provide optimum resolution and throughput for maximum detectability and productivity for next-generation process requirements. A key contributor to our unique position as the macro inspection market leader in both front-end wafer processing and final manufacturing is our all-surface inspection systems for wafer frontside, edge and backside defects. And, Rudolph inspection solutions like the August NSX® Series continue to set the standard for outgoing quality control and post-fab applications including bump, saw and probe.