The NSX^® family is the market leader for automated macro defect inspection for advanced packaging. Built on that success, the NSX 320 system offers specific inspection solutions for processes using through silicon vias (TSVs) to connect multiple die in a single package, and continuing to serve critical inspection needs for edge trimming metrology, wafer alignment during bonding processes and sawn wafers on film frames. With high acceleration staging, high-speed multi-processor computing and highly flexible software capabilities, the NSX 320 delivers industry-leading speed and sensitivity.

For specific details regarding the NSX 320 system, please contact us.