The B20™ System provides quick and thorough inspection of the wafer backside. The Class 1 cleanroom certified system uses both darkfield and brightfield illumination to handle both polished and unpolished backside surfaces. Featuring a compact collection optics design, the B20 can quickly detect particulates, residues and mechanical damages caused by equipment handlers and chucks - defects that are known to affect frontside device yield. Color imaging is used on the B20 for reliable defect detection, enhanced offline review and accurate defect sizing. The B20 can be fully optimized and production ready in less than 10 minutes.