The B30™ Module provides quick and thorough inspection of the wafer backside. The Class 1 cleanroom certified system uses both darkfield and brightfield illumination to handle both polished and unpolished backside surfaces. Featuring a compact collection optics design, the B30 can quickly detect particulates, residues and mechanical damages caused by equipment handlers and chucks - defects that are known to affect frontside device yield. Color imaging is used on the B30 for reliable defect detection, enhanced offline review and accurate defect sizing. The B30 can be fully optimized and production ready in less than 10 minutes.

Single Cabinet E/B Module

Explorer Inspection Cluster

For more information about the B30 Module, please contact us.