The E25™ System provides automated wafer edge top and edge normal inspection with throughputs of greater than 80 WPH (300 mm). The Class 1 certified system has an approximate 10 minute set-up time to be fully optimized and production ready. Featuring on-the-fly color defect image capture and intrinsic ADC capabilities, the E25 System can automatically detect and classify defects on the entire wafer edge, from the edge exclusion area to the bottom bevel. Both brightfield and darkfield illumination are available.