The E30™ Module provides automated wafer edge top and edge normal inspection with throughputs of greater than 100 WPH (300 mm). The Class 1 certified system has an approximate 10 minute set-up time to be fully optimized and production ready. Featuring on-the-fly color defect image capture, Edge Bead Removal (EBR) metrology, and advanced binning capabilities, the E30 Module can automatically detect and classify defects on the entire wafer edge, from partial patterned area to the bottom bevel. Both brightfield and darkfield illumination are available.

Single Cabinet E/B Module

Explorer Inspection Cluster

For more information about the E30 Module, please contact us.