The E30+B30 Inspection Module combines both edge and backside inspection into one enclosure. It retains all the capabilities of the proven E30 and B30 Module in one small footprint. The Class 1 certified system can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.

Explorer Inspection Cluster

For more information about the E30+B30 Module, please contact us.