The NSX® Series is a proven high-throughput and repeatable macro defect inspection solution used throughout the device manufacturing process. Macro defects (defects 0.5 micron and larger) can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. The NSX quickly and accurately detects yield-inhibiting defects, providing quality assurance and valuable process information. This information may be transferred to yield management programs, including Rudolph's DMS Decision™ software and fabwide DMSVision™ software for further analysis and review, reducing manufacturing costs and time to market.