The NSX® Series is a proven high-throughput and repeatable macro defect inspection solution used throughout the device manufacturing process. Macro defects (defects 0.5 micron and larger) can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. The NSX quickly and accurately detects yield-inhibiting defects, providing quality assurance and valuable process information. This information may be transferred to Discover™, Rudolph's yield management software, for further analysis and review.

Reduce your manufacturing costs and time-to-market. For more information about the NSX Series, contact us.