For both standard and flip chip 200 mm and 300 mm wafers, the Wafer Scanner (WS) Inspection System provides superior yield management for macro defect inspection throughout post-fab processes. Defects created in the post-fab area between wafer processing and final manufacturing can negatively impact product yields and time-to-market. The WS3840 quickly and reliably locates wafer defects and classifies them, reducing process costs and improving yield.

Building on the success of the industry-standard WS3840 Inspection System, Rudolph has developed an ultra-high resolution, 5 micron spot size sensor for gold bump applications. This enables high-speed 3D inspection and metrology of 300mm wafers. This feature is now available as an option on the WS3840. 

For more information about the Wafer Scanner Inspection System, please contact us.