For both standard and flip chip wafers for 200 mm and 300 mm in diameter, the WS3840 Wafer Inspection System provides superior yield management for defect inspection throughout post-fab processes. Defects created in the post-fab area between wafer processing and final manufacturing can negatively impact production yields and time-to-market. The WS3840 quickly and reliably locates wafer defects and classifies them -- reducing process costs and improving yield. No wonder the WS3840 is the industry standard for advanced packaging applications.

For more information about the WS3840 System, please contact us.