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WaferView Series

The WaferView® 320 inspection and review system offers the industry's highest throughput for 20um resolution. The WaferView 320 is specifically designed to maximize yield in lithography applications. The full-color vision system has been fab-tested to catch critical defects missed by gray-scale systems, and its patented software, based on over a decade of semiconductor production experience, provides superior defect classification for high-confidence automated decision-making. Rapid defect review, disposition, and root-cause analysis by yield engineers is made possible with the on-board high-resolution ReviewScope™ microscope.

 

Overview

  • Captures a wide range of lithography defects with fully automated macro defect inspection for the frontside, edge top, and backside of wafers
  • Defect definitions can be customized to meet existing classifications and new defect classes can be created as processes evolve through the use of patented automatic defect classification technology
  • Yield engineers can inspect defects immediately, without transporting the wafer to a separate review station, with the on-board high-magnification ReviewScope microscope
  • The ReviewScope microscope offers sub-micron defect inspection capability
  • As part of the WaferView Team™, the standalone inspection systems offer the same inspection technology as the integrated i-MOD ADI™ in lithography tracks—all systems are tied together with the YieldView® software for full fab-defect management
  • Meets industry standards for 200mm and 300mm automation
  • Minimizes 300 mm transportation and queuing delays with optional 4 FOUP load port configurations
  • Identifies and automatically classifies defects 20 microns or larger with industry-leading throughput
  • Captures whole wafer images with simultaneous brightfield and darkfield illumination
  • Automatically adapts to normal wafer-to-wafer and lot-to-lot process variations with robust full-color detection algorithms