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WaferWoRx 300 System

The WaferWoRx 300®, through analysis of the probe mark, reveals the true performance under actual test conditions of the prober, probe card, and setup. Replacing time-consuming manual analysis with automated probe mark data collection and analysis, the WaferWoRx 300 delivers quantifiable data and easy-to-interpret results in minimal time, enabling you to rapidly assess your probing process, identify and analyze issues within the process, and define solution options.

Overview

  • High-resolution 3D and 2D probe mark and probe tip inspection
  • Proprietary WaferWoRx software provides prober setup and performance analysis for increased control of the probing process
  • Test-at-Temperature probing analysis delivers true test cell performance of prober and probe card
  • Advanced algorithms and image-based analysis enable rapid screening of probed wafers for potential bond pad punch-through