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WaferWoRx 300 System

The WaferWoRx 300®, through analysis of the probe mark, reveals the true performance under actual test conditions of the prober, probe card, and setup. Replacing time-consuming manual analysis with automated probe mark data collection and analysis, the WaferWoRx 300 delivers quantifiable data and easy-to-interpret results in minimal time, enabling you to rapidly assess your probing process, identify and analyze issues within the process and define solution options.

 

For more information about the WaferWoRx 300 System, please contact us.

Overview

  • High-resolution 3D and 2D probe mark and probe tip inspection
  • Proprietary WaferWoRx software provides prober setup and performance analysis for increased control of the probing process
  • Test-at-Temperature probing analysis delivers true test cell performance of prober and probe card
  • Advanced algorithms and image-based analysis enable rapid screening of probed wafers for potential bond pad punch-through