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Metrology Systems for Advanced Processes

Rudolph provides full-fab solutions with its ellipsometry and PULSE Technology™ tools for thin-film measurements that are used in all stages of semiconductor manufacturing, from advanced gate formation to copper interconnect structures. Our focus on next-generation process challenges includes systems designed for modularity, providing flexible platform solutions to meet our customers changing requirements.

FE VII and FE VII-S Systems

Laser Ellipsometry Technology

Measure films using multiple wavelengths and multiple angles of incidence for fast, reliable measurement of thick films
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MetaPULSE System

Opaque Film Metrology

The industry’s first production-worthy opaque film metrology tool
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MetaPULSE-G System

Opaque Film Metrology

Delivers superior performance on Cu films that are critical in advanced device technologies and new TSV processes
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MetaPULSE-III System

Opaque Film Metrology

The MetaPULSE-III offers superior on-product measurements of ultrathin to thick opaque films
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MetaPULSE-IIIa System

Opaque Film Metrology

Achieve high throughput and low cost-of-ownership for film thickness measurements in aluminum applications
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S3000 CD System

Optical Critical Dimension Metrology

Discover the benefits of multi-angle, multi-wavelength laser scatterometry
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S3000A System

Fab-Wide Transparent Metrology

Optimized price and performance for non-diffusion film applications
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S3000S System

Fab-Wide Transparent Metrology

Offers simultaneous FBE and DUVR measurement in advanced diffusion and fabwide thin film applications
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