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MetaPULSE G System

The MetaPULSE® G is a thin film measurement tool optimized specifically for copper damascene processes at 45nm through 22nm technology nodes, and copper via fill in new 3D applications. This new metrology system is the latest addition to Rudolph's MetaPULSE line -- the industry standard for thickness measurements on opaque films. The MetaPULSE G delivers superior performance on copper films that are critical in advanced device technologies and new TSV processes. Unlike optical and x-ray techniques, it measures film thickness using a time-resolved acoustic signal that can be used in active die in the absence of special underlying test pads.

 

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Overview

  • Measure 60-80 product WPH with gauge-capable precision and reduced CoO
  • High-reliability, green wavelength ultra-fast laser is optimized for copper applications, delivering higher signal-to-noise ratios and measurement repeatability better than 0.3%
  • 10x10 micron spot size assures measurement capability on product wafers in 30x30 micron or smaller test sites
  • Targeted for Cu EP, post-CMP Cu line array thickness, TSV-electroplate Cu applications
  • Reduce laser consumable cost by 3x