Development collaboration includes: leading process tool supplier, IC device manufacturer and Rudolph Technologies, which will provide the inspection systems
Flanders, New Jersey (January 18, 2011)—Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities announced today that it will collaborate with a leading process tool supplier and an IC device manufacturer in the development of 3D advanced semiconductor packaging applications.
The development effort involves the integration of defect inspection with a de-bonding tool. Manufacturing efficiencies, along with the ability to handle ultra-thin wafers, necessitates the integration of inspection in de-bonding applications. Rudolph is bringing its unique inspection technologies to this three-way collaboration to provide this integrated process control solution. The first two revenue-generating Rudolph F30™ inspection modules will ship in Q1, 2011.
“Rudolph Technologies is pleased to participate in such a forward-looking program with two of the industry’s leading technology drivers. It is gratifying to be recognized and chosen by these top-tier companies as the clear industry leader of inspection and metrology applications within the realm of final manufacturing and packaging,” said Ardy Johnson, Rudolph’s vice president of marketing and product management.
Advanced 3D stacked packaging is driving the need for new process tool development that includes temporary wafer-carrier bonding and de-bonding applications. These process steps are paramount to support the necessary wafer thinning that is critical in the development of next generation miniaturized devices.
During the manufacturing process of these advanced packages, high-resolution edge inspection helps to ensure that trimmed wafer edges do not have any hairline cracks, chips or mechanical flaws that may lead to wafer breakage during the thinning process. This edge inspection can now be performed on the F30 module, and also includes the wafer notch area which is especially prone to mechanical failures. After wafer thinning, the F30 module may perform a frontside inspection to verify that all of the temporary bonding material has been thoroughly removed. A backside inspection of a flipped wafer can also be performed to ensure that the thinning process did not mechanically damage the surface and that the TSV contact areas have been properly processed. Wafer disposition after inspection may require re-work and this decision can be made quickly and automatically for high-volume manufacturing applications through an industry standard communication protocol directly to the process tool.
Rudolph Technologies, Inc. is a worldwide leader in the development, manufacture and support of defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The company’s yield management solutions are used in both the wafer processing and final manufacturing of ICs, as well as in emerging markets such as LED and solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company’s web site at www.rudolphtech.com.
Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefit to customers of Rudolph’s products, demand for Rudolph’s products and Rudolph’s ability to focus on and invest in strategic opportunities as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, the challenges presented by the new product development and marketing, Rudolph’s ability to overcome technological barriers, delays in shipping products for technical performance, component supply or other reasons, and the company’s ability to leverage its resources to improve its positions in its core markets. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2009 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.
For more information, please contact:
Investors:
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com
Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com