Flanders, New Jersey (September 29, 2009) -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today the availability of a complete 2D and 3D automated macro inspection portfolio optimized specifically for the rapidly growing gold bump market.
The gold bump market is at an inflection point as it prepares to switch from 200mm to 300mm wafer processing. Gold bump devices are typically used as drivers of LCD display systems. With the proliferation of consumer products that have LCD display screens, gold bumped wafers have been in steady demand in recent years. However, as the displays are becoming thinner and lighter, gold bump dimensions and gaps have been steadily shrinking to accommodate the overall system requirements.
Building on the success of its Wafer Scanner™ (WS) 3D macro inspection tool, Rudolph has developed an ultra-high resolution 5 micron spot size sensor for gold bump applications that enables high-speed 3D inspection and metrology of 300mm wafers. This feature is now available as an option on the competitively priced WS3840™ Inspection System.
“The Wafer Scanner System is the industry standard for high speed 3D inspection and metrology for solder and gold bumps,” stated Reza Asgari, Rudolph’s product line manager for the WS Systems. “The new spot size for 5 micron allows for high-speed measurement of bump height as well as detection of critical 3D defects such as midget bumps.”
Rudolph Technologies’ NSX® 2D Inspection Systems have traditionally had a very strong presence in the 200mm gold bump inspection market. Rudolph now offers this 2D capability on its flagship NSX 115 Inspection System for 300mm wafer processing. "Our NSX line is the industry standard for high-speed 100% 2D inspection," commented Rajiv Roy, vice president of business development and director of back-end product management. "When coupled with Rudolph’s proprietary laser dark-field illumination, the NSX is able to detect nodule and crater defects that are critical in the manufacture of gold bumps.”
NSX Systems incorporate a laser dark-field designed to detect both bumps and surface defects without affecting throughput. As the gap between bumps shrink to below 8 microns, the corresponding spot size on the laser shrinks to below 8 microns to discriminate between bumps.
“The combination of the NSX and Wafer Scanner is a compelling value proposition for the gold bump manufacturer,” Roy concluded, “and allows easy optimization of 2D and 3D inspection while accommodating a smooth product transition from 200mm and 300mm."
Rudolph is accepting orders now with initial shipments planned for the first quarter of 2010.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph’s strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company’s web site at www.rudolphtech.com.
Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include demand for Rudolph’s products, Rudolph’s existing market position and its ability to maintain and advance such position relative to its competitors, the benefit to customers of Rudolph’s products and Rudolph’s expectations about our future bookings and backlog as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, delays in shipping products for technical performance, component supply or other reasons, the company’s ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2008 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.
Contacts:
Investors:
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com
Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com