Stability and tool-to-tool matching key factors in selection of Rudolph’s S3000A transparent metrology systems for gate oxide dielectric process
FLANDERS, NJ (February 16, 2010)—Rudolph Technologies, Inc. (NASDAQ, RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced today that it has received multiple orders from a long-standing customer valued at $5 million for its S3000A™and MetaPULSE® III thin film metrology systems. The systems, representing a capacity buy from this Tier One memory manufacturer, are expected to ship to multiple fabs in 1Q and 2Q 2010.
“Memory customers are beginning to increase wafer production capacity as NAND and DRAM business improves. Consequently, we are starting to see the result of our development investments in leading-edge thin-film applications,” stated Mayson Brooks, vice president of sales at Rudolph. “The S3000A systems, featuring our latest laser-based focused beam ellipsometry and MAControl™ (molecular airborne contamination) removal capabilities, meet the customer’s repeatability, stability and tool-to-tool matching requirements for the evolving needs of gate oxide applications. Gate oxide has become thinner with advanced technology nodes, and for the 4X node, our customer concluded that Rudolph’s laser ellipsometry technology offers the preferred solution.”
“The MetaPULSE III, our latest-generation opaque metrology tool designed for high-volume memory processes, will be used for copper metrology applications including Cu seed/barrier, ECD and CMP. Unlike competing techniques such as scatterometry and x-ray, Rudolph’s PULSE™ Technology offers the capability for all of the above copper processes in a single tool. It is able to directly measure thickness and other metrology parameters on product wafers in the active device regions for the most accurate process control, as opposed to indirect measurements on special test structures in the scribe lines,” Brooks concluded.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of defect inspection, process control metrology, and data analysis systems used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. Rudolph offers yield management solutions used in wafer processing and final manufacturing through a family of systems for macro-defect inspection (detection and classification), as well as transparent and opaque thin film measurements.
The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph’s strategy for continued technological and market leadership includes aggressive research and development of complementary inspection and metrology solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company’s web site at www.rudolphtech.com.
Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include demand for Rudolph’s products, Rudolph’s existing market position and its ability to maintain and advance such position relative to its competitors and Rudolph’s expectations about our future bookings and backlog as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, delays in shipping products for technical performance, component supply or other reasons, the company’s ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2008 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.
Contacts:
Investors:
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com
Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com