Nearly every device manufacturer uses Rudolph systems to improve process control and manufacturing productivity – increasingly important considerations in the competitive and evolving semiconductor manufacturing environment. Our commitment to invest in research and development has resulted in bringing the best possible metrology, inspection and process control solutions to the industry.

• Advanced macro defect inspection for both wafer processing and final manufacturing applications
• Thin film metrology for transparent and opaque films, from advanced gate formation to copper interconnect structures
• Fabwide yield analysis and advanced process control software, delivering real-time root cause analysis while enhancing productivity

Download our application capability brochure