Connecting Industry, July 2011
Reza Asgari, Wafer Scanner Product Manager at Rudolph Technologies Inc., explores how a new wafer scanner system enables 2D/3D bump metrology and inspection for advanced packaging processes.
Critical three dimensional (3D) inspection and measurement capabilities are required for rapidly emerging advanced packaging applications. Many of these new processes use small metallic contacts, generically known as bumps, to provide connections to the internal elements of the integrated circuit.
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