May 28, 2013
Rudolph to Participate in Two Investor Conferences
• DA Davidson 5th Annual Technology Forum
• Credit Suisse Semiconductor Supply Chain Conference
News
May 2, 2013
Rudolph Technologies Launches S3000SX Transparent Thin Film Metrology System for 28nm Node and Below
New S3000SX System in a modular architecture with small site measurement capability offers flexibility and cost of ownership advantage for advanced process nodes
May 2, 2013
Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications
• Validates commercialization of revolutionary 2X stepper total lithography solution
• Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process
