Published in Advanced Packaging Semi-monthly, May 2007

"The value of fast, accurate inspection capability, which can detect existing defects and preempt further process investment, is multiplied in multichip packaging applications by the large investment already made in the multiple, fully processes die and the unrecoverable nature of the packaging process. One serious defect can kill its own die and take the rest of the stack down as well. Multichip packages have proliferated recently as consumers have demanded more functionality, smaller size, faster performance, longer battery life in handheld communication and entertainment devices."

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