Semiconductor International Packaging Edition, April 2006

"Manufacturers can lose millions of dollars to bump connectivity and adhesion defects. Yield losses at this stage are particularly costly, since the wafers have completed the fabrication process and production costs are fully vested. To help boost yields or protect against potential losses, bump processes incorporate various inspection techniques to automatically collect data after each process step. The inspection data typically includes an image of the wafer and a wafer map that indicates which die passed or failed inspection."

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