Test and Measurement World, June 2005

"Bumped wafers, and thus bumped chips, facilitate flip-chip mounting techniques. By eliminating the need for leaded packages, metal bumps reduce costs and enhance reliability.The capability to use metal as direct contacts on a chip also lets designers place I/O connections across the chip’s surface, not just along its edges. In addition, the direct placement of contact points on a wafer can reduce processing and rework costs."