Semiconductor Packaging News, January 2011

"In this era of sub-22nm manufacturing, with its prohibitively expensive fabs, what's a semiconductor engineer to do? Well, a lot of us are turning to advanced packaging.

If you think back to the transition from J-leaded devices to surface mount devices, those were the "Wild West" days of packaging, and it looks like those days are here again. Every creative packaging "cowboy" is dreaming up creative ways of to stack 'em high."

- Rajiv Roy

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