Rudolph Technologies has made all-surface, 100% advanced macro defect inspection and metrology a reality. An innovation that not only improves yields by performing high-speed automated inspection on the frontside, but also quickly identifies edge and/or backside defects, such as cracks, chip-outs, delamination, residuals, particles and flaking.

Four Types of All Surface Wafer Inspection:

Frontside Advanced Macro Defect Inspection

Advanced macro defect inspection, the inspection of defects 0.5µm and greater, is critical to wafer manufacturers that recognize the value of defect inspection and metrology to monitor their processes, provide process enhancing information and ultimately lower manufacturing costs and time to market.

Wafer Edge Inspection and Metrology

Edge Exclusion Defect Inspection
Edge exclusion inspection is a random defect detection process on the wafer edge aimed at identifying contamination that signifies other process problems.
Edge Bevel Inspection (Edge Normal)
Edge bevel inspection focuses on the side edge of a wafer to determine if it has any chips, cracks, contamination or layering delamination.
Edge Bead Removal (EBR) and Edge Exclusion Metrology
This topside surface measurement is required exclusively in the photolithography process, primarily to determine if wafers have been properly aligned for the creation of the edge exclusion region.

Advanced Wafer Backside Inspection

The primary purpose of backside inspection is to determine if equipment chucks and pallets are creating contamination or damage and identify any defects to prevent them from being spread throughout the fab.

Frontside Post-fab Die and Wafer

Advanced macro defect inspection within the final manufacturing process provides microelectronic device manufacturers with quality assurance and process information.