It is critical for device manufacturers using advanced packaging technologies to have accurate and complete bump data to ensure consistent bump height and coplanarity. In addition, bumps are inspected for placement and size. Inspecting for bump integrity ensures the accurate connectivity of bumps to bond pads.
Typical defects include:
- Bumps too big or too small
- Misplaced bumps
- Missing bumps
- Satellite bumps
- Misshaped bumps
- Bump height
- Others