Advanced macro defect inspection within the final manufacturing process provides microelectronic device manufacturers with quality assurance and process information. Automated inspection detects defects which may be created during wafer manufacturing, probing, bumping, dicing or general handling, and can have a major impact on device and process quality. The information learned through post-fab inspection can lead to accelerated time to market, improved efficiency and reduced manufacturing costs, ultimately leading to increased yields.

Typical defects include:

• Residue
• Scratches
• Chipouts
• Cracks
• Passivation defects
• Probe mark defects
• Bump defects