Defect Detection, Analysis, Classification and Review

Rudolph’s Total Solution package includes one or more Rudolph inspection modules, Discover^® Software for inline defect analysis and data management and TrueADC™ Software for inline automatic defect classification. Using this approach, wafer fabs and advanced packaging facilities can improve yield by performing high-speed, automated inspection using the Rudolph F30™ or NSX^® inspection module for frontside defect detection, and can quickly identify edge and/or backside defects using the E/B inspection module(s). Rudolph inspection systems can detect defects down to one micron on patterned wafers. Discover Software is designed to seamlessly handle advanced macro frontside, edge and backside inspection results. When the E30™ and B30™ modules are paired with a wafer frontside inspection module, correlation of defect data from all surfaces provides faster, more efficient response to defectivity issues.