September 29, 2015

Rudolph Acquires Inspection Technology of Stella Alliance, LLC

Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

September 1, 2015

Rudolph Technologies NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology

Newest macro defect inspection tool with configurable 2D and 3D measurements provides superior capability and cost of ownership

August 3, 2015

Rudolph Technologies Reports 2015 Second Quarter Results

• Financial Results Exceeded Guidance and Marked the Fifth Consecutive Quarter of Growth;
• Penetration into Advanced Packaging Lithography Market Continues to Gain Traction

July 20, 2015

Rudolph Announces Appointment of New Board Member, David B. Miller

July 14, 2015

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Dicing and laser saw systems, together with inspection systems and yield-enhancing software, provide revolutionary control and accuracy

July 14, 2015

New Equipment Sentinel Fault Detection and Classification Software from Rudolph Technologies Maximizes Value from all Fab Data

New software solution integrates wafer and sensor level data streams to enable advanced fault detection to optimize equipment and fab performance

July 13, 2015

Rudolph Technologies Positively Preannounces Increase in Second Quarter Revenue

Preliminary Q2FY15 revenue anticipated to reach approximately $59 million

July 8, 2015

Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications

Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost

June 22, 2015

Bosch Selects Rudolph for Dynamic Semiconductor Inspection Solutions

F30 inspection systems selected for their flexibility to be used as a single base inspection tool for a variety of MEMS applications in both front- and back-end processes

May 22, 2015

Rudolph Technologies to Participate in the D.A. Davidson & Co. 7th Annual Technology Forum Investor Conference May 27, 2015