April 1, 2015

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

NSX Series was selected due to its specialized die boundary inspection and highly sensitive detection capabilities

March 10, 2015

Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications

Tool to be used for development of copper pillar bumping and TSV processes

February 9, 2015

Ruling Issued in Rudolph’s Patent Infringement Case Against Camtek

Damages and modified injunction reinstated against Camtek in US

February 9, 2015

Rudolph Technologies to Participate in the 2015 Stifel Technology, Internet & Media Conference

February 2, 2015

Rudolph Technologies Reports 2014 Fourth Quarter and Year-end Results

Fourth Quarter Revenue and Non-GAAP EPS Significantly Exceeded Guidance
Full Year Revenue, Gross Margin, and Non-GAAP Net Income and EPS Grew in 2014

February 2, 2015

Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications

Overall market growth drives semiconductor processing ramp and increased demand for Rudolph’s JetStep Advanced Packaging Lithography System.

January 19, 2015

Rudolph Technologies Schedules 2014 Fourth Quarter and Full Year Financial Results Conference Call for February 02, 2015

January 13, 2015

Rudolph to Host Company Sponsored Analyst Event at the New York Stock Exchange February 4, 2015 (New York, NY)

January 7, 2015

Rudolph Technologies to Participate in the 17th Annual Needham Growth Conference

December 9, 2014

Rudolph Technologies to Participate in the 3rd Annual Midtown CAP Summit 2014