Yield Forum Series

July 15, 2016

Rudolph Redeems $60 Million in Convertible Notes

Rudolph Technologies Redeems Convertible Notes

July 11, 2016

Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection

Rudolph unveils new Inspection Technology.

June 30, 2016

Rudolph Technologies Schedules 2016 Second Quarter Financial Results Conference Call for July 28, 2016

RTEC Q2 2016 Earnings Call Notification

June 28, 2016

Rudolph Receives Multi-System Order for Over $11 Million From a Leading OSAT for Fan-out Wafer Level Packing Inspection

Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP).

June 24, 2016

Rudolph Technologies to Participate in the Eighth Annual CEO Investor Summit 2016

Accredited investor and publishing research analyst event to be held concurrently with SEMICON West and Intersolar 2016 in San Francisco.

May 12, 2016

Rudolph Technologies to Present at Second Quarter 2016 Investor Conferences

May 9, 2016

Rudolph Technologies Appoints Debbora Ahlgren as Vice President of Global Customer Operations

May 2, 2016

Rudolph Technologies Reports 2016 First Quarter Results

• Strong Sales of Process Control Solutions Drive Increase in Results to High-End of Guidance

April 7, 2016

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Initial orders for new High-speed 3D Metrology NSX system, totaling $5 million, demonstrate early success

April 6, 2016

Rudolph Technologies Schedules 2016 First Quarter Financial Results Conference Call for May 2, 2016