Yield Forum Series

April 7, 2016

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Initial orders for new High-speed 3D Metrology NSX system, totaling $5 million, demonstrate early success

April 6, 2016

Rudolph Technologies Schedules 2016 First Quarter Financial Results Conference Call for May 2, 2016

April 5, 2016

Rudolph to Host Company Sponsored Analyst Event May 9, 2016 in New York, NY

March 23, 2016

Veeco Receives Order for New Predictive Analytics Platform Featuring Rudolph Software

New Predictive Analytics Platform Lowers Customer Maintenance Costs and Improves Equipment Uptime

February 3, 2016

Rudolph Announces Win in Patent Infringement Lawsuit against Camtek

Judgment rendered in first of three patent infringement lawsuits

February 1, 2016

Rudolph Technologies Reports 2015 Fourth Quarter and Year-End Results

• Advanced Packaging Drives Record Sales Year;
• Lithography Business Unit Completes Third Consecutive Year of Growth

February 1, 2016

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line

Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market

January 11, 2016

Rudolph Technologies Schedules 2015 Fourth Quarter and Full Year Financial Results Conference Call for February 1, 2016

January 6, 2016

Rudolph Technologies to Present at 18th Annual Needham Growth Conference

December 14, 2015

Rudolph Receives Multi-system Order for Over $15 Million from Leading Foundry for Advanced Packaging Inspection

NSX 330 Inspection Systems selected for large-scale ramp of package production