June 28, 2016
Rudolph Receives Multi-System Order for Over $11 Million From a Leading OSAT for Fan-out Wafer Level Packing Inspection
Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP).
June 24, 2016
Accredited investor and publishing research analyst event to be held concurrently with SEMICON West and Intersolar 2016 in San Francisco.
May 9, 2016
May 2, 2016
• Strong Sales of Process Control Solutions Drive Increase in Results to High-End of Guidance
April 7, 2016
Initial orders for new High-speed 3D Metrology NSX system, totaling $5 million, demonstrate early success
April 6, 2016
March 23, 2016
New Predictive Analytics Platform Lowers Customer Maintenance Costs and Improves Equipment Uptime
February 3, 2016
Judgment rendered in first of three patent infringement lawsuits