Newsroom

November 17, 2014

Rudolph Gains Traction in Mobile Device Market with Multi-System Orders for its MetaPULSE G Metrology System

MetaPULSE G system has been widely adopted for critical process control of advanced components in smartphones and mobile devices

September 2, 2014

Rudolph Wins Yield Management Software Sale from the College of Nanoscale Science and Engineering

Leading research enterprise recognizes the value of the analytics that Rudolph’s Yield Management Software will bring to its Global 450 Consortium program

July 7, 2014

Veeco Partners With Software Solutions Provider Rudolph Technologies To Improve Customer Productivity and Equipment Cost of Ownership

May 20, 2014

Rudolph Announces Record Installations of its Advanced Process Control Software

Following a record number of Yield Management Software installations, Rudolph experiences increased demand for its Advanced Process Control Software as it becomes critical to customers in maintaining yield during high-volume manufacturing

May 14, 2014

Rudolph Technologies to Present at the 15th Annual B. Riley Investor Conference

February 24, 2014

Rudolph Technologies Announces Record Installations for its Yield Management Systems

Increasing demand for productivity information driven by need for increased yields

February 10, 2014

Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for Through Silicon Via Process Development

First NSX 320 Metrology system sold specifically for TSV application includes specialized sensors to measure critical parameters in 3D integration

February 3, 2014

Rudolph Technologies Wins Multiple Lithography Orders

Systems sold into advanced packaging and flat panel display markets

November 21, 2013

Rudolph Wins Multiple Orders for AWX Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications

AWX system combines the sensitivity, speed and data analysis needed to optimize back-end processes and minimize cost

June 24, 2013

Rudolph Announces the JetStep Panel Lithography System for Advanced Packaging

Unique stepper design is driven by the semiconductor advanced packaging transition from wafer to panel manufacturing