Newsroom

May 1, 2017

Multiple Orders for Rudolph’s Firefly Inspection System Marks Early Success

The Firefly System with Clearfind Technology helps manufacturers find defects earlier in the process – improving reliability of devices

February 16, 2017

Rudolph Receives Multi-System Order from Leading Memory Manufacturer for Advanced Memory Ramp

Validates new 3D metrology option on NSX Systems for bump process control

September 6, 2016

Rudolph Technologies Unveils New Inspection Suite for Front- and Back-end Semiconductor Manufacturing

Rudolph continues to drive the technological innovation of its inspection and metrology products to deliver solutions that address the demanding needs across front- and back-end processes

June 28, 2016

Rudolph Receives Multi-System Order for Over $11 Million From a Leading OSAT for Fan-out Wafer Level Packing Inspection

Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP).

April 7, 2016

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Initial orders for new High-speed 3D Metrology NSX system, totaling $5 million, demonstrate early success

March 23, 2016

Veeco Receives Order for New Predictive Analytics Platform Featuring Rudolph Software

New Predictive Analytics Platform Lowers Customer Maintenance Costs and Improves Equipment Uptime

February 1, 2016

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line

Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market

December 14, 2015

Rudolph Receives Multi-system Order for Over $15 Million from Leading Foundry for Advanced Packaging Inspection

NSX 330 Inspection Systems selected for large-scale ramp of package production

December 2, 2015

Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph

Lithography stepper gains further traction in advanced packaging and flat panel markets

November 2, 2015

Rudolph’s Yield Management System Software Expands Adoption in Advanced Packaging

Rudolph receives multi-fab order for Discover Enterprise Yield Management System software, which will provide advanced analytics of bump metrology