May 2, 2013
Rudolph Technologies Launches S3000SX Transparent Thin Film Metrology System for 28nm Node and Below
New S3000SX System in a modular architecture with small site measurement capability offers flexibility and cost of ownership advantage for advanced process nodes
May 2, 2013
Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications
• Validates commercialization of revolutionary 2X stepper total lithography solution
• Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process
April 29, 2013
Rudolph Purchases Selected Assets from Tamar Technology; Adds 3D Measurement Capability for Advanced Packaging Applications
Tamar’s unique and established technologies deliver critical process control metrology for flip-chip copper pillar bumping and other emerging applications
February 11, 2013
Rudolph’s Discover Yield Management Software Gains Traction in Advanced Packaging Applications
Back-end manufacturers adopt front-end strategies to maximize yields with analysis of inspection and metrology data
December 12, 2012
Rudolph Enters Back-end Lithography Market with Breakthrough Total Solution for Advanced Packaging
Rudolph Acquires Azores Corp. and Unveils JetStep—A Revolutionary 2X Reduction Stepper Total Lithography System
November 27, 2012
Rudolph’s Yield Management System Chosen for Manufacture of High Definition Displays in Mobile Devices
Genesis® Enterprise offline yield analysis and data management will be used to maximize factory efficiency and identify causes of yield loss
September 4, 2012
Rudolph’s MetaPULSE System Selected for Advanced Packaging R&D
Dynamic growth in advanced packaging arena drives need for critical process characterization technologies
July 9, 2012
Rudolph Delivers New Metal Film Metrology Capability to Mobile Display Market
New MetaPULSE FP was developed to provide critical control of manufacturing processes needed to enhance yields and ensure product quality
May 29, 2012
Large Assembly and Test Facility Selects Rudolph NSX Series to Meet Advanced Packaging Demand
Wafer-level packaging drives inspection market growth – as demonstrated by this large order for 14 NSX Inspection Systems
February 6, 2012
Rudolph Enters New Market for Metrology in Back-End Packaging
MetaPULSE system measurements of UBM and RDL on product wafers displace monitor wafer methodology as pattern-dependent deposition effects become significant
