Newsroom

April 7, 2016

Rudolph Adds High-speed 3D Metrology to the NSX Series for Advanced Packaging Process Control

Initial orders for new High-speed 3D Metrology NSX system, totaling $5 million, demonstrate early success

March 23, 2016

Veeco Receives Order for New Predictive Analytics Platform Featuring Rudolph Software

New Predictive Analytics Platform Lowers Customer Maintenance Costs and Improves Equipment Uptime

February 1, 2016

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line

Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market

December 14, 2015

Rudolph Receives Multi-system Order for Over $15 Million from Leading Foundry for Advanced Packaging Inspection

NSX 330 Inspection Systems selected for large-scale ramp of package production

December 2, 2015

Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph

Lithography stepper gains further traction in advanced packaging and flat panel markets

November 2, 2015

Rudolph’s Yield Management System Software Expands Adoption in Advanced Packaging

Rudolph receives multi-fab order for Discover Enterprise Yield Management System software, which will provide advanced analytics of bump metrology

September 29, 2015

Rudolph Acquires Inspection Technology of Stella Alliance, LLC

Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

September 1, 2015

Rudolph Technologies NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology

Newest macro defect inspection tool with configurable 2D and 3D measurements provides superior capability and cost of ownership

July 14, 2015

New Equipment Sentinel Fault Detection and Classification Software from Rudolph Technologies Maximizes Value from all Fab Data

New software solution integrates wafer and sensor level data streams to enable advanced fault detection to optimize equipment and fab performance

July 8, 2015

Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications

Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost