February 24, 2014

Rudolph Technologies Announces Record Installations for its Yield Management Systems

Increasing demand for productivity information driven by need for increased yields

February 10, 2014

Rudolph Ships New NSX 320 TSV Metrology System to CEA-Leti for Through Silicon Via Process Development

First NSX 320 Metrology system sold specifically for TSV application includes specialized sensors to measure critical parameters in 3D integration

February 3, 2014

Rudolph Technologies Wins Multiple Lithography Orders

Systems sold into advanced packaging and flat panel display markets

November 21, 2013

Rudolph Wins Multiple Orders for AWX Unpatterned Wafer Inspection Tools in Back-End and Advanced Packaging Applications

AWX system combines the sensitivity, speed and data analysis needed to optimize back-end processes and minimize cost

June 24, 2013

Rudolph Announces the JetStep Panel Lithography System for Advanced Packaging

Unique stepper design is driven by the semiconductor advanced packaging transition from wafer to panel manufacturing

May 2, 2013

Rudolph Technologies Launches S3000SX Transparent Thin Film Metrology System for 28nm Node and Below

New S3000SX System in a modular architecture with small site measurement capability offers flexibility and cost of ownership advantage for advanced process nodes

May 2, 2013

Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications

• Validates commercialization of revolutionary 2X stepper total lithography solution
• Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process

April 29, 2013

Rudolph Purchases Selected Assets from Tamar Technology; Adds 3D Measurement Capability for Advanced Packaging Applications

Tamar’s unique and established technologies deliver critical process control metrology for flip-chip copper pillar bumping and other emerging applications

February 11, 2013

Rudolph’s Discover Yield Management Software Gains Traction in Advanced Packaging Applications

Back-end manufacturers adopt front-end strategies to maximize yields with analysis of inspection and metrology data

December 12, 2012

Rudolph Enters Back-end Lithography Market with Breakthrough Total Solution for Advanced Packaging

Rudolph Acquires Azores Corp. and Unveils JetStep—A Revolutionary 2X Reduction Stepper Total Lithography System