November 2, 2015

Rudolph’s Yield Management System Software Expands Adoption in Advanced Packaging

Rudolph receives multi-fab order for Discover Enterprise Yield Management System software, which will provide advanced analytics of bump metrology

September 29, 2015

Rudolph Acquires Inspection Technology of Stella Alliance, LLC

Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

September 1, 2015

Rudolph Technologies NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology

Newest macro defect inspection tool with configurable 2D and 3D measurements provides superior capability and cost of ownership

July 14, 2015

New Equipment Sentinel Fault Detection and Classification Software from Rudolph Technologies Maximizes Value from all Fab Data

New software solution integrates wafer and sensor level data streams to enable advanced fault detection to optimize equipment and fab performance

July 8, 2015

Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications

Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost

June 22, 2015

Bosch Selects Rudolph for Dynamic Semiconductor Inspection Solutions

F30 inspection systems selected for their flexibility to be used as a single base inspection tool for a variety of MEMS applications in both front- and back-end processes

April 27, 2015

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

The JetStep System boasts new productivity improvements and lower cost-of-ownership

April 16, 2015

Rudolph Receives Multiple System Orders for Inspection, Metrology and Analytics of High-end Frequency Filters

Tools will be used to accelerate ramp and improve yields for SAW/BAW filters, a critical enabling technology for smartphones

April 1, 2015

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

NSX Series was selected due to its specialized die boundary inspection and highly sensitive detection capabilities

March 10, 2015

Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications

Tool to be used for development of copper pillar bumping and TSV processes