January 17, 2008
Rudolph Technologies Schedules 2007 Fourth Quarter and Full Year Earnings Conference Call for February 7, 2008
January 22, 2008
Rudolph Announces Intellectual Property and Asset Purchase from RVSI Inspection
Recent acquisitions keep Rudolph on the back-end fast track
January 29, 2008
Rudolph Technologies Launches High-Productivity AXi 940 Inspection Module
All-surface Explorer now available with top, edge and backside inspection
February 20, 2008
Rudolph Joins Leading Chipmakers in SEMATECH’s Metrology Program at UAlbany NanoCollege
Joint creation of International Process Characterization program will integrate inspection, metrology and data analysis solutions to enable manufacturing at 32 nm and beyond
March 6, 2008
Rudolph Ships MetaPULSE-III to Asia Memory Fab for Copper Interconnect Metrology
Memory move to copper interconnect sparks demand for broad application metrology tool
April 15, 2008
Rudolph Announces Installation of Multiple NSX Tools at WIN Semiconductors’ GaAs Foundry
NSX System provides the throughput and defect sensitivity needed for a cost-effective inspection solution
April 18, 2008
Rudolph Technologies Schedules 2008 First Quarter Earnings Conference Call for May 5, 2008
May 5, 2008
Rudolph Technologies Announces First Quarter Revenue Sequentially Increased 14% Exceeding Guidance
May 8, 2008
Rudolph Technologies Receives Multiple System Order for AXi 940 Inspection Modules
Strong early orders affirm value of new tool in production environment
May 15, 2008
Rudolph Announces New Wafer Scanner 3840 System for Post-Fab Inspection and 3D Bump Metrology
First unit in production following efficient integration of manufacturing operations
May 28, 2008
Rudolph Receives Multiple System Orders from Data Storage Manufacturer
Data storage industry experiences dramatic growth despite current economic environment
June 30, 2008
Rudolph Technologies Receives Follow-on Order from Micronas for NSX Macro Defect Inspection System
Discover software complements NSX, providing complete in-line defect analysis and data management solutions for automotive applications
July 15, 2008
Rudolph’s Next-Generation PrecisionWoRx VX4 Extends the Capabilities of Leading Probe Card Test and Analysis Tool
Efficient integration of probe card operations is key to maintaining company’s number one leadership position in back-end inspection and test
August 4, 2008
Rudolph Technologies Announces Second Quarter Revenue Sequentially Increased Exceeding Guidance
September 3, 2008
Rudolph Technologies Announces Orders for WaferWoRx 300 Probing Process Analysis Systems
Sales momentum continues as Rudolph’s newly acquired products and technologies help customers improve their operating efficiency
September 8, 2008
Rudolph Releases New Wafer Edge and Backside Macro Inspection Modules
New, production-worthy systems deliver improved sensitivity while maintaining high throughput
September 22, 2008
Rudolph Announces Appointment of New Board Member, Leo Berlinghieri
October 3, 2008
Notice of Conference Call for Rudolph Technologies
October 30, 2008
Rudolph Technologies Announces Third Quarter Revenue Increased with Earnings Exceeding Guidance
December 2, 2008
Rudolph’s New Explorer Macro Defect Inspection System Gains Traction with Low Cost-of-Ownership
System addresses critical edge and backside defectivity issues in 45 nm and 32 nm manufacturing
December 2, 2008
Rudolph NSX Selected for Inspection and Metrology of New Through-Silicon Via Process
System performs 2D and 3D metrology and inspection of defects during the same production cycle
