January 3, 2008

Rudolph Technologies to Present at the 10th Annual Needham Growth Stock Conference

January 17, 2008

Rudolph Technologies Schedules 2007 Fourth Quarter and Full Year Earnings Conference Call for February 7, 2008

January 22, 2008

Rudolph Announces Intellectual Property and Asset Purchase from RVSI Inspection

Recent acquisitions keep Rudolph on the back-end fast track

January 29, 2008

Rudolph Technologies Launches High-Productivity AXi 940 Inspection Module

All-surface Explorer now available with top, edge and backside inspection

February 7, 2008

Rudolph Technologies Announces Fourth Quarter and 2007 Year End Results

February 20, 2008

Rudolph Joins Leading Chipmakers in SEMATECH’s Metrology Program at UAlbany NanoCollege

Joint creation of International Process Characterization program will integrate inspection, metrology and data analysis solutions to enable manufacturing at 32 nm and beyond

March 6, 2008

Rudolph Ships MetaPULSE-III to Asia Memory Fab for Copper Interconnect Metrology

Memory move to copper interconnect sparks demand for broad application metrology tool

April 15, 2008

Rudolph Announces Installation of Multiple NSX Tools at WIN Semiconductors’ GaAs Foundry

NSX System provides the throughput and defect sensitivity needed for a cost-effective inspection solution

April 18, 2008

Rudolph Technologies Schedules 2008 First Quarter Earnings Conference Call for May 5, 2008

May 5, 2008

Rudolph Technologies Announces First Quarter Revenue Sequentially Increased 14% Exceeding Guidance

May 8, 2008

Rudolph Technologies Receives Multiple System Order for AXi 940 Inspection Modules

Strong early orders affirm value of new tool in production environment

May 15, 2008

Rudolph Announces New Wafer Scanner 3840 System for Post-Fab Inspection and 3D Bump Metrology

First unit in production following efficient integration of manufacturing operations

May 28, 2008

Rudolph Receives Multiple System Orders from Data Storage Manufacturer

Data storage industry experiences dramatic growth despite current economic environment

June 16, 2008

Rudolph Technologies to Host Analyst Meeting at Semicon West

June 30, 2008

Rudolph Technologies Receives Follow-on Order from Micronas for NSX Macro Defect Inspection System

Discover software complements NSX, providing complete in-line defect analysis and data management solutions for automotive applications

July 9, 2008

Rudolph Technologies Second Quarter Revenue to Exceed Guidance, Sequential Revenue Growth Forecast for the Third Quarter

July 14, 2008

Rudolph Technologies Announces Sale of Lead Scanner Assets to BKM Technology Partners

July 15, 2008

Rudolph’s Next-Generation PrecisionWoRx VX4 Extends the Capabilities of Leading Probe Card Test and Analysis Tool

Efficient integration of probe card operations is key to maintaining company’s number one leadership position in back-end inspection and test

July 15, 2008

Rudolph Technologies, Inc. Wins Summary Judgement Ruling Against Camtek, Ltd.

August 4, 2008

Rudolph Technologies Announces Second Quarter Revenue Sequentially Increased Exceeding Guidance

September 3, 2008

Rudolph Technologies Announces Orders for WaferWoRx 300 Probing Process Analysis Systems

Sales momentum continues as Rudolph’s newly acquired products and technologies help customers improve their operating efficiency

September 8, 2008

Rudolph Releases New Wafer Edge and Backside Macro Inspection Modules

New, production-worthy systems deliver improved sensitivity while maintaining high throughput

September 22, 2008

Rudolph Announces Appointment of New Board Member, Leo Berlinghieri

October 3, 2008

Notice of Conference Call for Rudolph Technologies

October 30, 2008

Rudolph Technologies Announces Third Quarter Revenue Increased with Earnings Exceeding Guidance

December 2, 2008

Rudolph’s New Explorer Macro Defect Inspection System Gains Traction with Low Cost-of-Ownership

System addresses critical edge and backside defectivity issues in 45 nm and 32 nm manufacturing

December 2, 2008

Rudolph NSX Selected for Inspection and Metrology of New Through-Silicon Via Process

System performs 2D and 3D metrology and inspection of defects during the same production cycle

December 19, 2008

Rudolph Reports Fourth Quarter Results Below Guidance and Announces Impairment and Write-down Charge