Newsroom

January 12, 2009

Rudolph Introduces Solar Fab Management Software for Photovoltaic Production

First software tool designed specifically to help solar cell manufacturers improve energy conversion efficiency and process yield

February 5, 2009

Rudolph Technologies Announces Fourth Quarter and 2008 Year End Results

February 9, 2009

Rudolph Announces Probing Process Analysis Capability for NSX Wafer Inspection System

New in-line capability provides accelerated probe test failure analysis and lower cost of ownership

March 5, 2009

Rudolph Announces Favorable Verdict in Patent Infringement Lawsuit

Jury finds Camtek Falcon System infringes Rudolph’s Patent

April 14, 2009

Rudolph Technologies Schedules 2009 First Quarter Earnings Conference Call for May 7, 2009

April 20, 2009

Rudolph Technologies and SEMATECH Extend Collaboration at UAlbany NanoCollege

Joint development research will focus on 3D TSV process control

May 7, 2009

Rudolph Technologies Announces First Quarter 2009 Results

May 11, 2009

Rudolph Announces New MetaPULSE-G Copper Film Metrology System

Latest PULSE™ Technology offers complete copper process control solution for advanced technology nodes and emerging TSV applications

June 4, 2009

Spire to Use Rudolph’s Process Control Software in its Turnkey Solar Cell Lines

June 15, 2009

Rudolph Announces All Surface Front-end Inspection Sale to Memory Manufacturer

Taiwan DRAM manufacturer orders all-surface inspection system for front-end manufacturing process control

July 13, 2009

Rudolph’s New S3000S Metrology System Delivers Cost of Ownership Advantage

Simultaneous advanced film characterization mode is first on market, delivering higher throughput and enhanced measurement capability

July 23, 2009

Rudolph Announces Multiple Orders for New Wafer Scanner 3840 Systems

Recent acquisition integration and WS3840 development well timed to meet market demand for high-speed 3D bump inspection and metrology

July 28, 2009

Rudolph Technologies Receives Multiple Orders for Production Opaque Film Metrology

On-product measurement capability, high precision and low cost of ownership drive selection of Rudolph’s MetaPULSE® Systems by major Asian memory manufacturer

August 3, 2009

Rudolph Technologies Acquires Adventa Control Technologies, Inc.

Company creates a complete enterprise solution in response to market demands

August 6, 2009

Rudolph Technologies Announces Second Quarter Revenue Increases 39% Exceeding Guidance

September 9, 2009

Court Judgment Favors Rudolph Technologies Patent Infringement Case

Permanent injunction entered against Camtek prohibits sale of Falcon Systems in USA

September 16, 2009

Rudolph Technologies Indicates Recovery Taking Hold, Back-end Semiconductor Manufacturing Heating Up

Strong orders coming from industry’s largest four OSATs and major foundries; sets the stage for upbeat SEMICON Taiwan in late September

September 29, 2009

Rudolph Now Offers Complete Solution for 200 and 300mm Gold Bump Inspection

September 29, 2009

Rudolph Technologies Releases Fast Review and Die Sort Classification Software for Back-end Manufacturing

Discover Software is able to dramatically reduce time and cost of defect review in back-end process environments

October 6, 2009

Rudolph Schedules Q3 Conference Call

October 8, 2009

Rudolph Technologies Receives Multiple System Order from ASE for its Complete Portfolio of Back-end Inspection Solutions

Rudolph sees significant market potential as leading manufacturers implement data analysis capability in their 2D and 3D in-line inspection for advanced packaging processes

November 2, 2009

Rudolph Technologies Announces Third Quarter Revenue Increases 52 Percent Exceeding Guidance

November 9, 2009

Rudolph’s Automated Data Analysis Software Improves Yield in MEMS Inspection

Touch Micro-SystemTech adds NSX with Discover Software to dramatically reduce per-wafer inspection time

December 8, 2009

Rudolph Announces Multiple Orders for Explorer Inspection Cluster from Taiwan Foundry

Automatic waferless recipe creation proves to provide added productivity for CMP inspection in a foundry environment