January 7, 2015

Rudolph Technologies to Participate in the 17th Annual Needham Growth Conference

January 13, 2015

Rudolph to Host Company Sponsored Analyst Event at the New York Stock Exchange February 4, 2015 (New York, NY)

January 19, 2015

Rudolph Technologies Schedules 2014 Fourth Quarter and Full Year Financial Results Conference Call for February 02, 2015

February 2, 2015

Rudolph Ships JetStep Lithography System for High-Volume Fan-Out Packaging Applications

Overall market growth drives semiconductor processing ramp and increased demand for Rudolph’s JetStep Advanced Packaging Lithography System.

February 2, 2015

Rudolph Technologies Reports 2014 Fourth Quarter and Year-end Results

Fourth Quarter Revenue and Non-GAAP EPS Significantly Exceeded Guidance
Full Year Revenue, Gross Margin, and Non-GAAP Net Income and EPS Grew in 2014

February 9, 2015

Rudolph Technologies to Participate in the 2015 Stifel Technology, Internet & Media Conference

February 9, 2015

Ruling Issued in Rudolph’s Patent Infringement Case Against Camtek

Damages and modified injunction reinstated against Camtek in US

March 10, 2015

Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications

Tool to be used for development of copper pillar bumping and TSV processes

April 1, 2015

Rudolph Secures $17M in Orders for Inspection of Critical Advanced Packaging Applications

NSX Series was selected due to its specialized die boundary inspection and highly sensitive detection capabilities

April 2, 2015

Rudolph Technologies Schedules 2015 First Quarter Results Conference Call for April 27, 2015

April 16, 2015

Rudolph Receives Multiple System Orders for Inspection, Metrology and Analytics of High-end Frequency Filters

Tools will be used to accelerate ramp and improve yields for SAW/BAW filters, a critical enabling technology for smartphones

April 27, 2015

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

The JetStep System boasts new productivity improvements and lower cost-of-ownership

April 27, 2015

Rudolph Technologies Reports 2015 First Quarter Results

• First Quarter Revenue and Non-GAAP EPS Exceeded Guidance;
• Record Quarterly Software Revenue Helped Drive 55 Percent Gross Margin

May 1, 2015

Rudolph Technologies to Participate in Two Investor Conferences

• The B. Riley & Co. 16th Annual Investor Conference; and
• The 9th Annual Barrington Research Spring Investment Conference

May 22, 2015

Rudolph Technologies to Participate in the D.A. Davidson & Co. 7th Annual Technology Forum Investor Conference May 27, 2015

June 22, 2015

Bosch Selects Rudolph for Dynamic Semiconductor Inspection Solutions

F30 inspection systems selected for their flexibility to be used as a single base inspection tool for a variety of MEMS applications in both front- and back-end processes

July 8, 2015

Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications

Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost

July 13, 2015

Rudolph Technologies Positively Preannounces Increase in Second Quarter Revenue

Preliminary Q2FY15 revenue anticipated to reach approximately $59 million

July 14, 2015

New Equipment Sentinel Fault Detection and Classification Software from Rudolph Technologies Maximizes Value from all Fab Data

New software solution integrates wafer and sensor level data streams to enable advanced fault detection to optimize equipment and fab performance

July 14, 2015

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Dicing and laser saw systems, together with inspection systems and yield-enhancing software, provide revolutionary control and accuracy

July 20, 2015

Rudolph Announces Appointment of New Board Member, David B. Miller

August 3, 2015

Rudolph Technologies Reports 2015 Second Quarter Results

• Financial Results Exceeded Guidance and Marked the Fifth Consecutive Quarter of Growth;
• Penetration into Advanced Packaging Lithography Market Continues to Gain Traction

September 1, 2015

Rudolph Technologies NSX 330 Series Widely Adopted for Advanced Packaging Inspection and Metrology

Newest macro defect inspection tool with configurable 2D and 3D measurements provides superior capability and cost of ownership

September 29, 2015

Rudolph Acquires Inspection Technology of Stella Alliance, LLC

Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

October 14, 2015

Rudolph Technologies Schedules 2015 Third Quarter Results Conference Call for November 2, 2015

November 2, 2015

Rudolph’s Yield Management System Software Expands Adoption in Advanced Packaging

Rudolph receives multi-fab order for Discover Enterprise Yield Management System software, which will provide advanced analytics of bump metrology

November 2, 2015

Rudolph Technologies Reports 2015 Third Quarter Results

• Strong Top Line Results Driven By Software and Lithography Sales;
• Earnings Per Share Significantly Exceeds Guidance

November 9, 2015

Rudolph Announces Retirement of Paul F. McLaughlin and Appointment of Michael P. Plisinski as New CEO and Director

Board names proven company veteran to become next CEO

November 25, 2015

Rudolph Technologies to Participate in the Fourth Annual Midtown CAP Investor Summit 2015

December 2, 2015

Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph

Lithography stepper gains further traction in advanced packaging and flat panel markets

December 14, 2015

Rudolph Receives Multi-system Order for Over $15 Million from Leading Foundry for Advanced Packaging Inspection

NSX 330 Inspection Systems selected for large-scale ramp of package production