April 15, 2008
Rudolph Announces Installation of Multiple NSX Tools at WIN Semiconductors’ GaAs Foundry
NSX System provides the throughput and defect sensitivity needed for a cost-effective inspection solution
FLANDERS, NJ (April 15, 2008) -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that seven NSX® Series inspection tools were recently installed at WIN Semiconductors, the world's leading foundry that serves the global wireless information and networking markets. Following a competitive evaluation, WIN also acquired multiple licenses for Rudolph's Discover™ defect analysis/yield management software.
Based in Taiwan, WIN is the largest pure play gallium arsenide (GaAs) foundry in the world, specializing in the manufacture of radio frequency integrated circuits for cell phones and other communications applications. WIN's purchase was driven by the NSX 105 system's proven capability to deliver high-volume throughput while maintaining the sensitivity to identify defects as small as one micron.
In looking at this customer's specific needs, Rudolph recommended a combined defect analysis/wafer-level signature recognition software package for 24/7 process monitoring. This data management system will help WIN to quickly and easily trace patterns back to yield-killing process issues.
"We are truly gratified by WIN's selection of the NSX and the commitment they have demonstrated by their NSX orders over the course of the past year," said Mayson Brooks, Rudolph's vice president of sales. "As the leading GaAs manufacturer, they have helped us understand and respond to the specific needs of this rapidly-growing market segment. We look forward to continuing to serve those needs as they execute their plans for further expansion in the coming year."
"The information provided by the NSX has been critical in our efforts to meet our customers' requirements for fast delivery and high quality," commented Chin-chi Chang, Ph.D, WIN's associate vice president, Monolithic Microwaver Integrated Circuit Business Unit. "At the same time, it helps us meet our own internal needs to quickly achieve profitable process yields. Its unique combination of throughput and sensitivity to small defects has been especially valuable as we strive to keep pace with rapid growth in our segment."
The NSX Series is a fast, repeatable macro defect inspection solution used throughout the semiconductor device manufacturing process. Macro defects can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. The NSX is specifically designed for the backend manufacturing environment where it can handle whole wafers and thinned wafers on film frames. It can quickly and accurately detect yield-inhibiting defects to provide quality assurance and valuable process information.
Rudolph's Discover™ Software helps device manufacturers solve yield-related problems and maximize fab productivity. By bringing together all inspection, electrical test and manufacturing information in a single analysis framework, it enables users to quickly find the sources of killer defects and manufacturing problems. It correlates wafer sort data to defects identified earlier in the production process, thereby allowing resources to focus on determining the root cause of yield excursions as early as possible in the production flow. By automating defect analysis with flexible alarms, it allows time to be spent solving problems, instead of collecting data. And, by providing the industry's most comprehensive set of correlation methods, Discover provides the most thorough way to attack yield-related problems.
Safe Harbor Statement
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For more information, please contact:
Steven R. Roth