Newsroom

February 7, 2011

Rudolph Wins Multiple System Orders for its Latest MetaPULSE G Metrology System

Combining improved sensitivity to copper, on product measurement capability, and cost of ownership improvements drive acceptance for high volume interconnect metrology

Flanders, New Jersey (February 7, 2011)—Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced today that it has received multiple system orders from a major Asian foundry and an IDM (integrated device manufacturer) with fabrication facilities in the U.S. for its latest MetaPULSE® G opaque metrology tool. Shipments to fulfill these orders are scheduled for Q4 ’10 through Q3 ‘11.

The MetaPULSE-G tool is Rudolph’s latest addition to the MetaPULSE line of opaque thin film thickness measurement systems. A new 515nm ultra-fast laser light source provides significant improvements in signal to noise and measurement repeatability. In addition to these improvements, throughput gains for typical measurements of as much as 50 percent, to over 60 wafers per hour, have been realized. Combined, these features can offer improved performance on advanced copper interconnect structures as well as significant reductions in cost of ownership, due, in large part, to higher throughput and lower cost of consumables.

“Interconnect metrology is becoming more challenging as our customers move to the 32nm process node and below. Thinner interconnect layers are driving needed improvements in film stack measurement precision and repeatability,” said Tim Kryman, Rudolph’s metrology business product manager. “In addition, pattern-dependent deposition characteristics exhibited in today’s advanced processes are pressing IDMs and foundries to move from monitor wafer and scribe line measurements to on product metrology. The MetaPULSE-G system’s unique laser source and improved signal detection are providing our customers a metrology solution with the required precision and repeatability at throughputs 1.5 to 2 times greater than competitive technologies. Similar to other systems in the MetaPULSE product line, the MetaPULSE-G tool also offers a small spot size which allows measurements to be made on product where actual device performance is determined. This all adds up to a unique combination of advanced capability and low cost of ownership which is driving customer acceptance.”

Rudolph’s MetaPULSE tools, the industry standard for opaque film metrology, use a laser-generated sonar pulse to measure the thickness and other properties of the material layers used to build a semiconductor device. In contrast to X-ray-based technologies, the small spot size of the MetaPULSE tools permits measurements directly on product wafers. Unlike optical critical dimension (OCD) technologies, MetaPULSE tools allow fast, easy creation of new recipes and do not require special structures like solid copper pads under measured structures.

Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The company’s yield management solutions are used in both the wafer processing and final manufacturing of ICs, as well as in emerging markets such as LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company’s web site at www.rudolphtech.com.

Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefit to customers of Rudolph’s products, the demand for Rudolph’s products, Rudolph’s existing market position and its ability to maintain and advance such position relative to its competitors and Rudolph’s expectations about our future bookings and backlog as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, delays in shipping products for technical performance, component supply or other reasons, the company’s ability to leverage its resources to improve its positions in its core markets and fluctuations in customer capital spending. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2009 and other filings with the Securities and Exchange Commission.  As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

For more information, please contact:

Investors:
Steven R. Roth
973.448.4302
steven.roth@rudolphtech.com

Trade Press:
Virginia Becker
952.259.1647
virginia.becker@rudolphtech.com