Productive defect detectability in multiple applications
The key to increasing data storage is increased platter utilization via smaller and smaller read/write magnetic heads
However, shrinking heads drives process complexity and requires a greater emphasis on defect control. Whether your application is inline defect characterization, pole-tip inspection, bondpad inspection, or outgoing final quality assurance; Rudolph Technologies NSX and AXi series are uniquely positioned with advanced resolutions required to detect the defects of interest at a low cost of ownership.
Probe mark inspection: quality assurance for Known Good Die and die products