NSX Metrology Series
Combining macro defect inspection and 3D metrology for advanced packaging applications
Combining macro defect inspection and 3D metrology for advanced packaging applications
Advanced transparent film metrology for the 28nm process node and below
2x reduction stepper for advanced packaging applications
Step-and-repeat lithography panel printer for up to Gen 3.5
Step-and-repeat lithography panel printer for up to Gen 4.5
Table top mask blank inspection for R&D
Run-to-run control
Fault detection and classification - collect and analyze data to prohibit scrap-generating events
Equipment Automation Software - Coordinate data flow between operators, equipment and factory systems
High performance ADC
Sort and defect spatial pattern recognition software
Run-to-run control
Seamless integration of yield and defect management software
Fault detection and classification - collect and analyze data to prohibit scrap-generating events
Equipment Automation Software - Coordinate data flow between operators, equipment and factory systems
Customer and application-specific mechanical and electrical interfaces that are critical for the probe card test and analysis process
High speed, high force, and high throughput for high pin-count, large array probe cards
Productive defect detectability in multiple applications
A fast, intuitive, off-line, all-surface review and classification solution
High performance ADC
High performance ADC for LED Manufacturers
Unpatterned wafer frontside inspection
Table top wafer inspection for R&D
Table top mask blank inspection for R&D
Table top wafer inspection for R&D