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July 1, 2009

Identifying Root Causes of Systemic Yield Loss Using Model-based Yield Analysis

Solid State Technology, July 2009

"In modern semiconductor fabs, final yield can be affected by many factors. From bare wafer to final packaging, hundreds of process steps are involved, and each process or tool can have an impact on final yield. Statistical process control (SPC) has been used extensively for monitoring process health and identifying out-of-control parameters. This article contrasts the limitations inherent in SPC with the benefits of using model-based yield analysis software and provides an example of these benefits based upon a case study using production data from a process line at a major memory manufacturer."

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