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May 2, 2012

Inspection for Advanced Packaging Applications

Advanced 2D/3D macro defect inspection within the final manufacturing process provides manufacturers with quality assurance and process information for a variety of applications.

Typical defects include:

  • Residue
  • Scratches
  • Chipouts
  • Cracks
  • Passivation defects
  • Probe mark defects
  • Bump defects

The NSX 320 and Wafer Scanner inspection systems are designed for advanced packaging facilities and test fabs requiring metrology and inspection to ensure device functionality in TSV processes.  All-surface inspection for TSV applications detects edge trim and edge chip defects and performs edge trimming metrology. The NSX 320 can perform 2D/3D via depth metrology and micro pillar bump height metrology . The Wafer Scanner System features laser triangulation technology, providing essential 3D inspection and metrology of micro solder and pillar bumps  in 3DIC manufacturing.