Combined defect inspection and 2D and 3D metrology
Cost-effective inspection and metrology for lower volume applications including research institutes, equipment vendors and consortia
Research, testing and prototyping are important steps in bringing new technologies to the semiconductor manufacturing floor.
The NSX 330 with all of it is 2D/3D capabilities is available without the cost of high volume robotic automation to bring state-of-the-art capability to the R&D. Systems can be later upgraded with automation solutions as your manufacturing needs grow.
Inspection and metrology solutions for
- pattern / bare wafer
- chip tray (waffle / gelpack)