Onto Innovation Lithography Products
JetStep W2300 System
Advanced packaging lithography system for round substrates up to 330mm
JetStep S3500 System
Advanced packaging lithography system for rectangular or square panel substrates up to Gen 3.5 size (720mm x 600mm)
JetStep G35 System
High-resolution imaging for flat panel display applications up to Gen 3.5 size
JetStep G45 System
High-resolution imaging for flat panel display applications up to Gen 4.5 size
JetStep X500 System
Designed for advanced integrated circuit substrates (AICS) or advanced packaging manufacturing applications, incorporating a 250mm x 250mm large field exposure area achieving 3μm L/S resolution over a large DOF and with a throughput of >110pph
